Hydra-MA-TF water-soluble ultra-low voiding resin-based synthetic tacky paste flux (REM1) F ultra-low voiding lead-free solder paste

ultra-low voiding lead-free solder paste engineered for mission-critical assemblies in the aerospace

- 1 x Matching manual plunger

Consistently shaped microscopic granules evenly suspended in a golden body of a rich in solids thick RMA soldering tacky flux

Activates immediately

micro-alloyed lead-free solder wire engineered for high-reliability selective soldering

Hydra-MA-TF water-soluble ultra-low voiding resin-based synthetic tacky paste flux (REM1) F ultra-low voiding lead-free solder pasteHydraMA TF water soluble resin based synthetic tacky paste flux (REM1) for high end soldering lead free BGA and SMD components. Medium activity with QC tracer effectively addressing BGA slumping issues. Customers who switch to Hydra MA don't look back! BGA solder sphere slumping is a defect that occurs during the reflow soldering process, where the solder spheres deform and spread out, resulting in poor solder joint formation. This can lead to various